Stress Singularity of Thermal Stresses in Three-Dimensional Bonded Structures with an Interlayer

Abstract:

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In the present paper, singular stress field at the vertex on the interface in three-dimensional bonded joints is analyzed using BEM and eigen analysis. The order of stress singularity is determined solving an eigen equation based on FEM formulation and the stress distribution is expressed using the result of the eigen-value analysis. A relationship between the thickness of interlayer and residual thermal stresses is presented. Then, a three-dimensional intensity of singularity is determined.

Info:

Periodical:

Key Engineering Materials (Volumes 385-387)

Edited by:

H.S. Lee, I.S. Yoon and M.H. Aliabadi

Pages:

573-576

DOI:

10.4028/www.scientific.net/KEM.385-387.573

Citation:

H. Koguchi and A. Taniguchi, "Stress Singularity of Thermal Stresses in Three-Dimensional Bonded Structures with an Interlayer", Key Engineering Materials, Vols. 385-387, pp. 573-576, 2008

Online since:

July 2008

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Price:

$35.00

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