Thermal Conductivity Measurement of the AlN Ceramics at the Grain Scale Using Thermoreflectance Technique

Sang Kee Lee; Ikuko Yamada; Shoichi Kume; Hiromi Nakano; Koji Watari

doi:10.4028/www.scientific.net/KEM.403.65

Paper Titles

Electrical Resistivity Control of Hot-Pressed Aluminum Nitride Ceramics
p.49

Fracture Resistance and Wear Properties of Silicon Nitride Ceramics
p.53

Oxidation of Rare Earth Silicon Oxynitride J-Phases
p.57

Effect of Second Phase After-Heat Treatment on the Thermal Conductivity of AlN Ceramics
p.61

Thermal Conductivity Measurement of the AlN Ceramics at the Grain Scale Using Thermoreflectance Technique
p.65

Viscosity Measurement of Molten RE-Mg-Si-O-N (RE=Y, Gd, Nd and La) Glasses
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First Principles Calculations of Advanced Nitrides, Oxides and Alloys
p.73

Advances in Computation of Temperature-Pressure Phase Diagrams of High-Pressure Nitrides
p.77

Luminescence Properties of α-SiAlONs and Related Compounds
p.83

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Thermal Conductivity Measurement of the AlN Ceramics at the Grain Scale Using Thermoreflectance Technique

Abstract:

The thermal conductivity at the micrometer-scale of AlN ceramics with eliminated grain boundary phase was measured by the thermoreflectance technique with periodic heating. Thermal conductivities were ranged from 160 to 260 W/m•K and an average value of 201 W/m•K was obtained from a 22 m2 area. The variation in the thermal conductivities was related to the individual AlN grains and grain boundary characteristics.