Thinning Silicon Wafer with Polycrystalline Diamond Tools

Pei Lum Tso; Cheng Huan Chen

doi:10.4028/www.scientific.net/KEM.404.157

Paper Titles

Polishing Performance of Electro-Rheological Fluid of Polymerized Liquid Crystal Contained Abrasive Grit
p.123

Study on Tribo-Fabrication in Polishing by Nano Diamond Colloid
p.131

Efficient Super-Smooth Finishing Characteristics of SiC Materials through the Use of Fine-Grinding
p.137

Polishing of Ultra Smooth Surface with Nanoparticle Colloid Jet
p.143

An Experimental Study on High Speed Grinding of Granite with a Segmented Diamond Wheel
p.149

Thinning Silicon Wafer with Polycrystalline Diamond Tools
p.157

Mechanisms of Al/SiC Composite Machining with Diamond Whiskers
p.165

Effect of Slurry and Nozzle on Hole Machining of Glass by Micro Abrasive Suspension Jets
p.177

Experimental Investigation of Temperatures in Diamond Wire Sawing Granite
p.185

HomeKey Engineering MaterialsKey Engineering Materials Vol. 404Thinning Silicon Wafer with Polycrystalline...

Thinning Silicon Wafer with Polycrystalline Diamond Tools

Abstract:

Sintered polycrystalline diamond (PCD) compacts are normally used for cutting tools, drill bits and wire dies. A novel application of PCD has been developed to use its entire surface carved to create different patterns which are triangle or square shape loaded with leveled millers that can shave brittle materials in ductile mode. Due to numerous cutting edges formed on the same level of PCD tools, which can be used to thin the wafer surface to achieve both flatness and smoothness of the industrial requirements. SEM has been used to observe the surface and subsurface of the thinned wafer surface. The critical depth of cut between ductile and brittle cutting mode is close to 2 µm in this thinning operation. The damaged layers of machined surface have been observed and studied in this paper.