Efficient Super-Smooth Finishing Characteristics of SiC Materials through the Use of Fine-Grinding

H. Kasuga; Hitoshi Ohmori; Wei Min Lin; Y. Watanabe; T. Mishima; Toshiro K. Doi

doi:10.4028/www.scientific.net/KEM.404.137

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Corrective Abrasive Polishing Processes for Freeform Surface
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Applications of Contact Length Models in Grinding Processes
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Polishing Performance of Electro-Rheological Fluid of Polymerized Liquid Crystal Contained Abrasive Grit
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Study on Tribo-Fabrication in Polishing by Nano Diamond Colloid
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Efficient Super-Smooth Finishing Characteristics of SiC Materials through the Use of Fine-Grinding
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Polishing of Ultra Smooth Surface with Nanoparticle Colloid Jet
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An Experimental Study on High Speed Grinding of Granite with a Segmented Diamond Wheel
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Thinning Silicon Wafer with Polycrystalline Diamond Tools
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Mechanisms of Al/SiC Composite Machining with Diamond Whiskers
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HomeKey Engineering MaterialsKey Engineering Materials Vol. 404Efficient Super-Smooth Finishing Characteristics...

Efficient Super-Smooth Finishing Characteristics of SiC Materials through the Use of Fine-Grinding

Abstract:

Silicon carbide (SiC) materials have increasingly been needed in the wide range of industries, such as for structural components, automobile parts, space telescope, X-ray mirror, and next-generation semiconductors. However, SiC materials have difficulties in super-smooth finishing because of their hard and brittle characteristics. The authors have been investigating appropriate conditions on their finishing by fine-grinding with the unique grinding process called ELID (Electrolytic In-process Dressing) grinding method. The ELID grinding method has a stable grinding ability, so very detailed characteristics of their material-remove mechanisms were to be investigated. Surface analysis of each material has been discussed through the ELID, and this study proposes good finishing conditions for SiC. In this paper, the advantages of the applied fine-grinding are shown, and unique features on grinding characteristics of SiC through various grinding experimental parameters are described.

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Periodical:

Key Engineering Materials (Volume 404)

Pages:

137-141

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.404.137

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Online since:

January 2009

Authors:

H. Kasuga, Hitoshi Ohmori, Wei Min Lin, Y. Watanabe, T. Mishima, Toshiro K. Doi

Keywords:

4H-SiC, ELID (ELectrolytic In-Process Dressing) Grinding, High Quality Surface, In-Feed Grinding, Sintered SiC, Surface Properties

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