Material Removal Model of Sapphire Substrate in Double-Side Lapping Process

Abstract:

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The material removal mechanisms of sapphire substrate in double-side lapping process were studied. The concepts of brittle vs. ductile machining and two-body vs. three-body abrasion were used to classify the processing mechanisms. The material removal models of double-side lapping process in different mechanisms were analyzed and researched. The experiment showed that the material removal model can describe double-side lapping process of sapphire qualitatively.

Info:

Periodical:

Key Engineering Materials (Volumes 407-408)

Edited by:

Fan Rui, Qiao Lihong, Chen Huawei, Ochi Akio, Usuki Hiroshi and Sekiya Katsuhiko

Pages:

460-464

DOI:

10.4028/www.scientific.net/KEM.407-408.460

Citation:

C. D. Lu et al., "Material Removal Model of Sapphire Substrate in Double-Side Lapping Process", Key Engineering Materials, Vols. 407-408, pp. 460-464, 2009

Online since:

February 2009

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Price:

$35.00

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