Material Removal Model of Sapphire Substrate in Double-Side Lapping Process

Cong Da Lu; Dong Min Qian; Shao Fei Jiang

doi:10.4028/www.scientific.net/KEM.407-408.460

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 407-408Material Removal Model of Sapphire Substrate in...

Material Removal Model of Sapphire Substrate in Double-Side Lapping Process

Abstract:

The material removal mechanisms of sapphire substrate in double-side lapping process were studied. The concepts of brittle vs. ductile machining and two-body vs. three-body abrasion were used to classify the processing mechanisms. The material removal models of double-side lapping process in different mechanisms were analyzed and researched. The experiment showed that the material removal model can describe double-side lapping process of sapphire qualitatively.

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Periodical:

Key Engineering Materials (Volumes 407-408)

Pages:

460-464

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.407-408.460

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Online since:

February 2009

Authors:

Cong Da Lu, Dong Min Qian, Shao Fei Jiang

Keywords:

Double-Side Lapping, Material Removal Model, Processing Mechanism, Sapphire

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References

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