Material Removal Model of Sapphire Substrate in Double-Side Lapping Process
The material removal mechanisms of sapphire substrate in double-side lapping process were studied. The concepts of brittle vs. ductile machining and two-body vs. three-body abrasion were used to classify the processing mechanisms. The material removal models of double-side lapping process in different mechanisms were analyzed and researched. The experiment showed that the material removal model can describe double-side lapping process of sapphire qualitatively.
Fan Rui, Qiao Lihong, Chen Huawei, Ochi Akio, Usuki Hiroshi and Sekiya Katsuhiko
C. D. Lu et al., "Material Removal Model of Sapphire Substrate in Double-Side Lapping Process", Key Engineering Materials, Vols. 407-408, pp. 460-464, 2009