High Efficient Mechanism of Material Removal in Two-Dimensional Ultrasonic Grinding from the Locus Perspective
Relative motion of single abrasive is analyzed for the different applied directions of longitudinal ultrasonic vibration, and its locus is simulated in the present paper. The research results show that the locus in two-dimensional ultrasonic vibration is only similar to that in y-direction, and both are close to sinusoid curves. The width of grooves scratched by abrasive grains y-direction (axial direction of grinding wheel) is two times of the vibration amplitude, and the material removal rate increases remarkably. In case of x-direction (tangential direction of grinding wheel) ultrasonic vibration, abrasive grains with periodic force impact material surface with high frequency vibration, which make material fracture removal easy. Therefore, the high efficiency essence of material removal in two-dimensional ultrasonic grinding is revealed in view of locus. In addition, according to the results of grinding experiments, under same conditions good surface quality can be obtained in two-dimensional ultrasonic grinding and material removal rate in common grinding is the lowest. Consequently it is further proved that the method of two-dimensional ultrasonic vibration grinding is an effective one for ceramic materials.
Bo Zhao, Xipeng Xu, Guangqi Cai and Renke Kang
M. L. Zhao et al., "High Efficient Mechanism of Material Removal in Two-Dimensional Ultrasonic Grinding from the Locus Perspective", Key Engineering Materials, Vol. 416, pp. 609-613, 2009