Research on Chip Formation Mechanisms of Nano-Composite Ceramics in Two-Dimensional Ultrasonic Grinding
Experimental research on grinding characteristics of nano-composites ceramics were carried out using diamond wheel in two-dimensional ultrasonic vibration grinding (TDUVG) and the topography of the scratched grooves were observed with Transmission Electron Microscope. The surface crack, plastic deformation and brittle-ductile transition during chip formation were analyzed. Subsequently, the grinding model of nano-composites ceramics machining in TDUVG was established based on fracture theory of micro-indentation in fracture region and plastic information mechanism of hard-brittle materials. The metamorphic layer can be divided into three regions: brittle-fracture, non-elastic deformation and residual damage region. Ultrasonic grinding process can be divided into three phase: elastic friction and extrusion, crack growth and crack propagation and chip formation.
Bo Zhao, Xipeng Xu, Guangqi Cai and Renke Kang
J. L. Tong et al., "Research on Chip Formation Mechanisms of Nano-Composite Ceramics in Two-Dimensional Ultrasonic Grinding", Key Engineering Materials, Vol. 416, pp. 614-618, 2009