Research on Chip Formation Mechanisms of Nano-Composite Ceramics in Two-Dimensional Ultrasonic Grinding

Abstract:

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Experimental research on grinding characteristics of nano-composites ceramics were carried out using diamond wheel in two-dimensional ultrasonic vibration grinding (TDUVG) and the topography of the scratched grooves were observed with Transmission Electron Microscope. The surface crack, plastic deformation and brittle-ductile transition during chip formation were analyzed. Subsequently, the grinding model of nano-composites ceramics machining in TDUVG was established based on fracture theory of micro-indentation in fracture region and plastic information mechanism of hard-brittle materials. The metamorphic layer can be divided into three regions: brittle-fracture, non-elastic deformation and residual damage region. Ultrasonic grinding process can be divided into three phase: elastic friction and extrusion, crack growth and crack propagation and chip formation.

Info:

Periodical:

Edited by:

Bo Zhao, Xipeng Xu, Guangqi Cai and Renke Kang

Pages:

614-618

DOI:

10.4028/www.scientific.net/KEM.416.614

Citation:

J. L. Tong et al., "Research on Chip Formation Mechanisms of Nano-Composite Ceramics in Two-Dimensional Ultrasonic Grinding", Key Engineering Materials, Vol. 416, pp. 614-618, 2009

Online since:

September 2009

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$35.00

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