Analysis of Stress Intensity Factor for Interfacial Crack in Bonded Dissimilar Plate under Bending

Hatsuki Kakuno; Kazuhiro Oda; Tetsuya Morisaki

doi:10.4028/www.scientific.net/KEM.417-418.153

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 417-418Analysis of Stress Intensity Factor for...

Analysis of Stress Intensity Factor for Interfacial Crack in Bonded Dissimilar Plate under Bending

Abstract:

This paper presents the simple method to determine the complex stress intensity factor of interface crack in bi-material plate under bending. In the present method, the stress values at the crack tip calculated by FEM are used and the stress intensity factors of interface crack are evaluated from the ratio of stress values between a given and a reference problems. A single interface crack in an infinite bi-material plate subjected to tension and shear is selected as the reference problem in this study. The accuracy of the present analysis is discussed through the results obtained by body force method. As the result, it is confirmed that the present method is useful for analyzing the interface crack under bending.

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Periodical:

Key Engineering Materials (Volumes 417-418)

Pages:

153-156

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.417-418.153

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Online since:

October 2009

Authors:

Hatsuki Kakuno, Kazuhiro Oda, Tetsuya Morisaki

Keywords:

Bending Specimen, Finite Element Model (FEM), Interface Crack, Stress Intensity Factor (SIF)

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References

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