Size Effect of a Crack in a Micropolar Piezoelectric Medium

Gan Yun Huang; Shou Wen Yu

doi:10.4028/www.scientific.net/KEM.417-418.525

Paper Titles

Vapor Pressure Modeling for Fire Damage Assessment of HPC
p.509

Inelastic Damage-Involved Response of Colliding Buildings during Earthquakes
p.513

Cohesive Release Loads in a General Finite Element Model of a Propagating Crack
p.517

Local Investigation of Microstructure-Induced Fatigue Damaging
p.521

Size Effect of a Crack in a Micropolar Piezoelectric Medium
p.525

Defects vs. Small Notches Competition in Fatigue Failure Initiation of Cast Steel
p.529

A Probabilistic Strength Prediction Method for Adhesively Bonded Joints Composed of Wooden Adherends
p.533

Heating Steady Thermal Stress in a Composite EFBF Plate Made of Ceramic/FGM/Metal Considered Temperature Dependency
p.537

Study of Risk Evaluation System of High Arch Dam Based on Failure Mechanism
p.541

HomeKey Engineering MaterialsKey Engineering Materials Vols. 417-418Size Effect of a Crack in a Micropolar...

Size Effect of a Crack in a Micropolar Piezoelectric Medium

Abstract:

A crack problem in a micropolar piezoelectric solid is considered. By using simplified constitutive relations, the problem can be reduced to the solution of a set of Cauchy singular integral equations with the help of Fourier integral transform technique. Numerical results for stress intensity factors, couple stress intensity factors and electric displacement intensity factors show that micropolar theory can be expected to explain certain size effects in piezoelectric solids.