Analysis of the Three-Dimensional Delamination Behavior of Stretchable Electronics Applications

Abstract:

Stretchable electronics offer potential application areas in biological implants interacting with human tissue, while also facilitating increased design freedom in electronics. A key requirement on these products is the ability to withstand large deformations during usage without losing their integrity. Experimental observations show that delamination between the metal conductor lines and the stretchable substrate may eventually lead to short circuits while also the delaminated area could result in cohesive failure of the metal lines. Interestingly, peel tests show that the rubber is severely lifted at the delamination front caused by its high compliance. To quantify the interface in terms of cohesive zone properties, these parameters are varied such that the experimental and numerical peel-force curve and rubber-lift geometry at the delamination front match. The thus obtained interface properties are used to simulate the delamination behavior of actual three-dimensional stretchable electronics samples loaded in tension.

• Periodical: Key Engineering Materials (Volumes 417-418)
• Pages: 9-12
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.417-418.9
• Online since: October 2009
• Authors: Olaf van der Sluis, P.H.M. Timmermans, E.J.L. van der Zanden, J.P.M. Hoefnagels
• Keywords: Cohesive Zone Modelling, Delamination, Fracture Mechanic, Peel Test, Stretchable Electronics, Thin Film

References

[1] T. Li, Z. Suo, S.P. Lacour, and S. Wagner. Compliant thin film patterns of stiff materials as platforms for stretchable electronics. Journal of Materials Research, 20: 3274-3277, (2005).

DOI: 10.1557/jmr.2005.0422

[2] M. Gonzalez, F. Axisa, M. Vanden Bulcke, D. Brosteaux, B. Vandevelde, and J. Vanfleteren. Design of metal interconnects for stretchable electronic circuits. Microelectronics Reliability, 48: 825-832, (2008).

DOI: 10.1016/j.microrel.2008.03.025

[3] D.S. Gray, J. Tien, and C.S. Chen. High conductivity elastomeric electronics. Advanced Materials, 16: 393-397, (2004).

DOI: 10.1002/adma.200306107

[4] L.B. Freund and S. Suresh. Thin film materials; Stress, defect formation and surface evolution. Cambridge University Press, (2006).

[5] M.D. Thouless and Q.D. Yang. A parametric study of the peel test. International Journal of Adhesion and Adhesives, 28: 176-184, (2008).

DOI: 10.1016/j.ijadhadh.2007.06.006

[6] O. van der Sluis, P.H.M. Timmermans, R.B.R. van Silfhout, W.D. van Driel, and G.Q. Zhang. Delamination modeling of three-dimensional microelectronic systems. In Proceedings of the 58th Electronic Components and Technology Conference (ECTC) 2008, (2008).

DOI: 10.1109/ectc.2008.4550189

[7] E.J.L. van der Zanden. Experimental-numerical analysis of copper-rubber interfaces in stretchable electronics. Master's thesis, Eindhoven University of Technology, (2008).

[8] M. Ortiz and A. Pandolfi. Finite-deformation irreversible cohesive elements for three-dimensional crackpropagation analysis. International Journal for Numerical Methods in Engineering, 44: 1267-1282, (1999).

DOI: 10.1002/(sici)1097-0207(19990330)44:9<1267::aid-nme486>3.0.co;2-7

[9] B.A.E. van Hal, R.H.J. Peerlings, M.G.D. Geers, and O. van der Sluis. Cohesive zone modeling for structural integrity analysis of IC interconnects. Microelectronics Reliability, 47: 1251-1261, (2007).

DOI: 10.1016/j.microrel.2006.08.017