Analysis and Modifying of Injection-Mold for Notebook Computer Housing by CAE

Abstract:

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In the paper, C-Mold software was applied to the analysis of injecting molding of the notebook computer housing so as to solve the main problems of warpage and injection unbalance of the product. According to the results of filling analysis, the problem has been found out and the mold design has been improved. The described case showed the capability of CAE to find the reasons that cause warpage, duration of cooling period, sink mark, blush, color variation and shrinkage directly or indirectly. Thus, CAE analysis has a wide application prospects in injection molding.

Info:

Periodical:

Key Engineering Materials (Volumes 426-427)

Edited by:

Dunwen Zuo, Hun Guo, Guoxing Tang, Weidong Jin, Chunjie Liu and Chun Su

Pages:

568-571

DOI:

10.4028/www.scientific.net/KEM.426-427.568

Citation:

B. Liu et al., "Analysis and Modifying of Injection-Mold for Notebook Computer Housing by CAE", Key Engineering Materials, Vols. 426-427, pp. 568-571, 2010

Online since:

January 2010

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Price:

$35.00

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