Research and Implement of Serial RapidIO on Chips Interconnection

Xiao Yun Huang; Bo Cheng; Hai Bing Su; Qin Zhang Wu

doi:10.4028/www.scientific.net/KEM.439-440.231

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 439-440Research and Implement of Serial RapidIO on Chips...

Research and Implement of Serial RapidIO on Chips Interconnection

Abstract:

A new type of multi-processor interconnected data processing system is developed based on SRIO protocol which is always used for interconnecting chips on a board. It solves two major bottlenecks of high-speed computing and high-speed communications effectively in realtime processing system. The hardware structure of the system is introduced in this paper, and a interconnecting network composed of four dsps is implemented in which any pair of dsps can communicate at 3.125Gbps.

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Periodical:

Key Engineering Materials (Volumes 439-440)

Pages:

231-235

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.439-440.231

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Online since:

June 2010

Authors:

Xiao Yun Huang, Bo Cheng, Hai Bing Su, Qin Zhang Wu

Keywords:

DSPC6455, Interconnect, Serial RapidIO, XC5VLX50T

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References

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