Machined Surface Characteristics and Removal Mechanism of Soft and Brittle Solids

Zhen Yu Zhang; Rudy Irwan; Han Huang

doi:10.4028/www.scientific.net/KEM.447-448.183

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Reverse Simulation of Sinking EDM for Intricate Shapes
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Machined Surface Characteristics and Removal Mechanism of Soft and Brittle Solids
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Nickel Injection Mould Fabrication via Proton Beam Writing and UV Lithography
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Parametric Study of Micro Machining Three Dimensional Microstructure with the Tiny-Grinding Wheel Based on the EMR Effect
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HomeKey Engineering MaterialsKey Engineering Materials Vols. 447-448Machined Surface Characteristics and Removal...

Machined Surface Characteristics and Removal Mechanism of Soft and Brittle Solids

Abstract:

Surface characteristics of CZT wafers machined using wire sawing, free abrasives lapping and polishing and ultra-precision grinding were investigated. Wire sawing resulted in the removal of material in both ductile and brittle regimes, but both polishing and grinding led to a ductile removal. The grinding produced very smooth surfaces free of embeddings and scratches, which is thus considered to have better machinability than the free abrasive machining. The nanoindentation and nanoscratch on MCT wafers at nanometric scales resulted in considerable plastic deformation, but no fracture features. The hardness of the MCT wafer was 500 to 550 MPa, and the coefficient of friction was particularly high, ranging from 0.45 to 0.55.

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Key Engineering Materials (Volumes 447-448)

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183-187

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https://doi.org/10.4028/www.scientific.net/KEM.447-448.183

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Online since:

September 2010

Authors:

Zhen Yu Zhang, Rudy Irwan, Han Huang

Keywords:

CdZnTe, Damage Mechanics, HgCdTe, Nanomechanics, Ultra-Precision Grinding

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