For applications of injection mould fabrication in the field of MEMS, proton beam writing (PBW) and UV lithography are combined to manufacture 2 mm thick Ni moulds with sub-10 µm fine features in 10 µm deep fluidic channels. PBW is capable of writing micro and nano features with straight and smooth sidewalls with sub-10 nm RMS roughness, while UV lithography has the advantage of large area structuring through a mask. A newly developed positive resist maP1275 hv is presented in combination with PBW and UV lithography for Ni injection mould fabrication. Fine micro pillars with straight and smooth sidewalls have been achieved by PBW and linked with UV lithography into a microfluidic channel. The new resist is successfully removed after electroplating without compromising the Ni mould.