Effects of Crystallographic Structure on Machining Performance with Polycrystalline Oxygen Free Copper by a Single Crystalline Diamond Micro-Tool

X. Ding; L.C. Lee; David Lee Butler; Kah Chuan Shaw

doi:10.4028/www.scientific.net/KEM.447-448.31

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 447-448Effects of Crystallographic Structure on Machining...

Effects of Crystallographic Structure on Machining Performance with Polycrystalline Oxygen Free Copper by a Single Crystalline Diamond Micro-Tool

Abstract:

A study was carried out to investigate effects of crystallographic structure on the machining performance with polycrystalline oxygen free copper (OFC) using a single crystalline diamond (SCD) micro-tool. The SCD micro-tool used in this study fabricated with a focused ion beam (FIB) has a cutting length of around 30 µm on the primary clearance face. It was found that a change in crystallographic orientation resulted in a variation in machining force, chip thickness and shear angle, leading to a change in machined surface integrity. When a micro-size tool traverses within a grain at a machining direction aligned with a particular crystallographic orientation, the work material in front of the machining tool is found to be severely deformed. If the orientation changes to a less favorable orientation, this may lead to a much reduced shear angle, a thicker chip, striation at the chip back, higher machining forces and a degraded machined surface. This study contributes to the understanding of the physics of micro scale mechanical machining (micro-machining).

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Periodical:

Key Engineering Materials (Volumes 447-448)

Pages:

31-35

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https://doi.org/10.4028/www.scientific.net/KEM.447-448.31

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Online since:

September 2010

Authors:

X. Ding, L.C. Lee, David Lee Butler, Kah Chuan Shaw

Keywords:

Crystallographic Orientation, Micro Machining, SCD Micro-Tool

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References

[1] J. Grum and M. Kisin: International Journal of Machine Tools and Manufacture, Vol. 43 (2003), pp.1545-51.

Google Scholar

[2] X. Ding, D. L. Butler, G. C. Lim, C. K. Cheng, K. C. Shaw, K. Liu, W. S. Fong and H. Y. Zheng: Journal of Micromechechanics and MicroEngineering, Vol. 19/2 (2009), pp.025005-16.

Google Scholar

[3] L. A. Giannuzzi, F. A. Stevie, Introduction to Focused Ion Beams Instrumentation, Theory, Techniques and Practice, Springer Publishing, Berlin (2005).

DOI: 10.1007/b101190

Google Scholar

[4] Information on http: /en. wikipedia. org/wiki/Miller_Index.

Google Scholar