Basic Characteristics of a Simultaneous Double-Side CMP Machine, Housed in a Sealed, Pressure-Resistant Container

Kei Kitamura; Toshiro K. Doi; Syuhei Kurokawa; Yoji Umezaki; Yoji Matsukawa; Yota Ooki; Tadashi Hasegawa; Isamu Koshiyama; Koichiro Ichikawa; Yoshio Nakamura

doi:10.4028/www.scientific.net/KEM.447-448.61

Paper Titles

The Effect of One Directional Ultrasonic Vibration Assistance in High Speed Meso-Scale Milling Process
p.41

Ultra Precision Machining of Non-Ferrous Metals and Nitrocarburized Tool Steel
p.46

Effects of Insert Nose Radius and Processing Cutting Parameter on the Surface Roughness of Aisi 316 Stainless Steel
p.51

Measurement of Spindle Thermal Growth on a Machine Intended for Micro/Meso Scale Milling
p.55

Basic Characteristics of a Simultaneous Double-Side CMP Machine, Housed in a Sealed, Pressure-Resistant Container
p.61

Atomic-Scale Planarization of Single Crystal Diamond Substrates by Ultraviolet Rays Assisted Machining
p.66

Achieving High Flatness of Workpiece Edge Shape by Considering Polishing Pressure
p.71

Microstructural Changes during Precision Machining of Thin Substrates
p.76

A Feasibility Study on Laser-Mechanical Drilling of SiC Ceramics
p.81

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Basic Characteristics of a Simultaneous Double-Side CMP Machine, Housed in a Sealed, Pressure-Resistant Container

Abstract:

We designed and manufactured a prototype of a unique CMP machine, which can perform double-side CMP simultaneously in a sealed and pressure container as regarding effective action of the processing atmosphere around workpieces as important. Polishing experiments with single crystal silicon (Si) wafers (100) are performed by charging the container with various gases. As a result, the removal rates increased by up to 25% under high pressure oxygen gas atmosphere.