Analysis of Heating Steady Temperature Field in an Al1100/Ti-6Al-4V/SiC 2D-FGM Plane Plate by FEM

Abstract:

The steady heat conduction problems under linear temperature load on upper surface in an Al1100/Ti-6Al-4V/SiC 2D-FGM plane plate are analyzed by the FEM. When the variation of the material composition in y-direction is linear, the plane temperature distributions with the changes of composition shape distribution coefficient mx and porosity coefficient Ax in x-direction are obtained. The results show that when mx<0.1, the temperature curve surface is upward convex. The smaller mx is, the bigger relative temperature gradient on the left side of the plate is. When mx>1.0, the temperature curve surface has smaller upward convex trend and becomes downward convex surface gradually with the increasing of the mx (except at =1). The bigger mx is, the bigger relative temperature gradient near the right ceramic side of the plate is. By comparison with the results of an Al1100/SiC 1D-FGM plate, in the 2D-FGM plane plate, when mx=0.5, the maximum value of the temperature difference near metal side increases by 15.6%, but the value near ceramic side reduces by 53%. The temperature curve surface has more obvious variation with the increasing of the Ax in the plate, especially it is when =0.3~0.5 and =0.2~0.5, the changes of the temperature difference value reach the maximum, and compared with Ax=0.0, the value of Ax=3.99 increases by 138.6% at =0.35 and =0.4. The results provide more comprehensive and concrete basis of calculation and the further analysis of thermal stress for the design and optimization of the 2D-FGM plane plate.

• Periodical: Key Engineering Materials (Volume 450)
• Pages: 235-238
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.450.235
• Online since: November 2010
• Authors: Yang Jian Xu, Ling Ling Wang, Hai Yang Du
• Keywords: Finite Element Model (FEM), Functionally Graded Material (FGM), Plane Plate, Temperature Field, Two-Dimension

References

[1] J. Sladek, V. Sladek, Ch. Hellmich, et al.: Comput. Mech. Vol. 39 (2007), p.323.

[2] J. Sladek, V. Sladek and J. Krivacek, et al.: Comput. Mech. Vol. 32 (2003), p.169.

[3] T. Elperin, G. Rudin: Heat and Mass Transfer Vol. 36 (2000), p.231.

[4] Z. F. Shi, T. T. Zhang and H. J. Xiang: Compos. Struct. Vol. 79 (2007), p.140.

[5] J. Zhao, X. Ai and Y. Z. Li: Heat Mass Transfer Vol. 43 (2007), p.1227.

[6] L. C. Guo, L. Z. Wu and H. J. Yu: Key Eng. Mater. Vols. 353-358 (2007), p.263.

[7] Y. Obata, N. Noda and T. Tsuji: JSME Int. J. Ser. A Vol. 58 (1992), p.1689.

[8] Y. Tanigawa, T. Akai, R. Kawamura, et al.: J. Therm. Stresses Vol. 19 (1996), p.77.

[9] M. Liviu: Int. J. Solids Struct. 42 (2005), p.4338.

[10] Y. J. Xu and D. H. Tu: Acta Materiae Compositae Sinica Vol. 20 (2003), p.94.

[11] M. Nematt-Allah: Int. J. Solids Struct. 40 (2003), p.7339.

[12] N. Noda: J. Therm. Stresses Vol. 20 (1997), p.373.