The Study of Underfill Epoxy Hardness in Reducing Curing Process Time for Flip Chip Packaging

Zainudin Kornain; Azman Jalar; Rozaidi Rashid; Shahrum Abdullah

doi:10.4028/www.scientific.net/KEM.462-463.1194

Paper Titles

Capacity Analysis of Urban Highway Intersections
p.1170

Failure Behaviour of Semantan Bamboo Strips Loaded in Bending and Shear
p.1176

Analysis of Thermo-Mechanical Stresses in Laminated Hollow Circular Cylinder with Finite Length
p.1182

Effects of Different Fillers on Microstructure and Tensile Properties of Welded AA6061-T6
p.1189

The Study of Underfill Epoxy Hardness in Reducing Curing Process Time for Flip Chip Packaging
p.1194

Cyclic Behavior of Electrical Resistance Type Low Stiffness, Large Strain Sensor by Using Carbon Nanofiber/Flexible Epoxy Composite
p.1200

Numerical Investigation of Curing Process in Reaction Injection Molding of Rubber for Quality Improvements
p.1206

Experimental and Analytical Studies of Fatigue Crack Growth in Peened after Skimmed Friction Stir Welded Joint of 2024-T351 Al Alloy
p.1212

Design Optimization of Bi-Tubular Thin Walled Columns for Crashworthiness Application
p.1218

HomeKey Engineering MaterialsKey Engineering Materials Vols. 462-463The Study of Underfill Epoxy Hardness in Reducing...

The Study of Underfill Epoxy Hardness in Reducing Curing Process Time for Flip Chip Packaging

Abstract:

Underfilling is the vital process to reduce the impact of the thermal stress that results from the mismatch in the co-efficient of thermal expansion (CTE) between the silicon chip and the substrate in Flip Chip Packaging. This paper reported the pattern of underfill’s hardness during curing process for large die Ceramic Flip Chip Ball Grid Array (FC-CBGA). A commercial amine based underfill epoxy was dispensed into HiCTE FC-CBGA and cured in curing oven under a new method of two-step curing profile. Nano-identation test was employed to investigate the hardness of underfill epoxy during curing steps. The result has shown the almost similar hardness of fillet area and centre of the package after cured which presented uniformity of curing states. The total curing time/cycle in production was potentially reduced due to no significant different of hardness after 60 min and 120 min during the period of second hold temperature.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Key Engineering Materials (Volumes 462-463)

Pages:

1194-1199

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.462-463.1194

Citation:

Cite this paper

Online since:

January 2011

Authors:

Zainudin Kornain, Azman Jalar, Rozaidi Rashid, Shahrum Abdullah

Keywords:

Ceramic Flip Chip Packaging, Curing Profile, Hardness, Nanoindenter, Underfill

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] M. Ying, A. Teng, Y.C. Chea: IEEE Elec. Pack. Tech. Conf. (Singapore 2007), p.805.

Google Scholar

[2] E. Goh, X. L. Zhao, A. Anand and Y. C. Mui: IEEE Elec. Pack. Tech Conf. (Singapore 2005), p.215.

Google Scholar

[3] J. Taweeplengsangsuke and R.A. Pearson: IEEE Adh. Join. and Coat. Tech. in Elect. Manufact. (Hong Kong 2000), p.174.

Google Scholar

[4] Z. Kornain, A. Jalar, R. Rashid, S. Abdullah: Adv. Mater. Research Vol. 97 (2010), p.23.

Google Scholar

[5] W.C. Oliver and G. M. Pharr: J. Mater. Res. Vol. 19 (2004), p.3.

Google Scholar

[6] X. Li, H. Gao, W. A. Scrivens, D. Fei, X. Xu, M. A. Sutton, A. P. Reynolds, and M. L. Myrick : Nanotech. Vol. 15. (2004), p.1416.

Google Scholar

[7] A. K. Dutta, D. Penumadu, and B. Files : J. Mater. Res. Vol. 19 (2004), p.158.

Google Scholar

[8] T. Y. Wu, Y. Tsukada, and W. T. Chen: IEEE Elec. and Comp. Tech. Conf. (1996), p.524.

Google Scholar