Thermal Stress and Thermal Cycling Analyses of Microgyroscope Chip Models

Meng Kao Yeh; Chun Lin Lu

doi:10.4028/www.scientific.net/KEM.462-463.622

Paper Titles

Numerical Simulation of Reflective Crack Forming in Semi-Rigid Asphalt Pavement Subjected to Traffic Load
p.599

Large Scale Elasto-Plastic Analysis Using Domain Decomposition Method Optimized for Multi-Core CPU Architecture
p.605

Prediction of Safety Factor for Slope Designed with Various Limit Equilibrium Methods
p.611

Mixed Mode Partition in one Dimensional Fractures
p.616

Thermal Stress and Thermal Cycling Analyses of Microgyroscope Chip Models
p.622

Parallel Eigen Frequency Analysis Using Enriched Free Mesh Method
p.628

Experimental Determination of Fatigue Life of Automotive Jounce Bumper
p.634

Analytical Solution for Pin-Supported Metal Foam Core Sandwich Beam with Local Denting
p.639

Effects of Al₂O₃-13% TiO₂ Coating Particle Size on Commercial Mild Steel via Plasma Spray Method
p.645

HomeKey Engineering MaterialsKey Engineering Materials Vols. 462-463Thermal Stress and Thermal Cycling Analyses of...

Thermal Stress and Thermal Cycling Analyses of Microgyroscope Chip Models

Abstract:

The thermal stress and thermal fatigue life for three different microgyroscope chip models were investigated in this paper. The deformation and stress distribution in chip, at interface between microgyroscope and chip, and in the spring of microgyroscope were obtained for three different microgyroscope chip models by the finite element method. The results show that for the simplified model, no obvious differences from linear or nonlinear analyses are obtained and the fatigue life of microgyroscope chip can be predicted with the properly simplified model. Also, the model having the same process in fabricating microgyroscope and carrier has better reliability. This paper provides an effective method for the reliability analysis of microgyroscope chip.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Key Engineering Materials (Volumes 462-463)

Pages:

622-627

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.462-463.622

Citation:

Cite this paper

Online since:

January 2011

Authors:

Meng Kao Yeh, Chun Lin Lu

Keywords:

Fatigue Life, Finite Element Model (FEM), Microgyroscope Chip, Thermal Cycling Analysis, Thermal Stress Analysis

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] C. P. Hsu, D. H. Tsai1, M. C. Yip and W. L. Fang: IEEE Sensors Conference (2007), p.800.

Google Scholar

[2] J. U. Knickerbocker, C. S. Patel, P. S. Andry, C. K. Tsang, L. P. Buchwalter, E. J. Sprogis, H. Gan, R. R. Horton, R. J. Polastre, S. L. Wright and J. M. Cotte: IEEE J. Solid-State Circuits, Vol. 41, No. 8 (2006), p.1718.

DOI: 10.1109/jssc.2006.877252

Google Scholar

[3] P. A. Miranda and A. J. Moll: IEEE Electronic Components and Technology Conference, (2006), p.844.

Google Scholar

[4] N. Ranganathan, K. Prasad, N. Balasubramanian and K. L. Pey: J. Micromech. Microeng., Vol. 18 (2008), p.1.

Google Scholar

[5] S. H. Choa: Microelectron. Reliab., Vol. 45 (2005), p.361.

Google Scholar

[6] G. Liu, A. Wang, T. Jiang, J. Jiao and J. B. Jang: Microsystems Technology, Vol. 14 (2008), p.199.

Google Scholar

[7] N. Tanaka, T. Sato, Y. Yamaji, T. Morifuji, M. Umemoto and K. Takahashi: IEEE Electronic Components and Technology Conference, (2002), p.473.

Google Scholar

[8] S. W. Yoon, S. Y. L. Lim, A. G. K. Viswanath, S. Thew, T. C. Chai and V. Kripesh: IEEE Trans. Adv. Packag., Vol. 31, No. 1 (2008), p.127.

DOI: 10.1109/tadvp.2007.914971

Google Scholar

[9] C. S. Selvanayagam, J. H. Lau, X. Zhang, S. K. W. Seah, K. Vaidyanathan and T. C. Chai: IEEE Electronic Components and Technology Conference, (2008), p.1073.

Google Scholar

[10] Release 11. 0 Documentation for ANSYS: Theory Reference, (2006).

Google Scholar

[11] M. K. Yeh and T. M. Hong: Proceedings of the 4th Asia Pacific Conference on Transducers and Micro/Nano Technologies, APCOT 4, Tainan, Taiwan, ROC, (2008), Paper No. 295.

Google Scholar

[12] R. Iannuzzelli: IEEE Electronic Components and Technology Conference, Atlanta, GA, USA (1991), p.410.

Google Scholar

[13] D. E. Riemer: Proc. 40th Electron. Compon. Technol. Conf., (1990), p.418.

Google Scholar

[14] JESD22-A104C, Temperature Cycling, JEDEC Standard, May (2005).

Google Scholar

[15] J. H. Lau: IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part B, Vol. 19, No. 4 (1996), p.728.

Google Scholar