Effect of Interfacial Reaction on Joint Strength of Semiconductor Metallization and Sn-3Ag-0.5Cu Solder Ball

Abstract:

Semiconductor packages that use metallization and lead-free solders are increasingly being used in electronic products. In this study, interface reactions and joint-strength reliability were investigated for Sn-3W%Ag-0.5W%Cu solder ball joints joined to Cr/Cu and Cr/Ni-40W% metallization layers that were heat treated at 260°C. The strength of the joint with the Cr/Cu metallization layer decreased as the duration of the heat treatment increased. Sn and Cr interface reactive layers were generated after the loss of Cu in the Cr/Cu metallization layer, but the connection was maintained. By contrast, the connection of the joint to the Cr/Ni-40W metallization layer was relatively stable under the heat treatment conditions investigated.

• Periodical: Key Engineering Materials (Volumes 462-463)
• Pages: 849-854
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.462-463.849
• Online since: January 2011
• Authors: Chiko Yorita, Tatsuya Kobayashi, Ikuo Shohji
• Keywords: Cr/Ni-W, Cu-Cr, Lead-Free Solder, Metallization, Sn-3Ag-0.5Cu, TEM

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