Experimental Study of Micro-Scale Laser Shock Peening on Copper Foils

W. Zhu; Jian Zhong Zhou; M Wang; Shu Huang; Deng Hui Wei; Yu Jie Fan

doi:10.4028/www.scientific.net/KEM.464.506

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HomeKey Engineering MaterialsKey Engineering Materials Vol. 464Experimental Study of Micro-Scale Laser Shock...

Experimental Study of Micro-Scale Laser Shock Peening on Copper Foils

Abstract:

Micro-scale laser shock peening (μLSP) is a flexible and precise process that can potentially be applied to metallic structures in micro devices to improve strength and reliability performance. In order to understand the mechanism of μLSP process, a typical experiment was carried out for copper foils specimen with various process parameters. Surface morphology, deformation and hardness of the specimens were observed and characterized by 3D microscope system and situ nano-mechanical test system respectively. It was found that overlapping rate of laser spot has a little effect on microscopic deformation depth which increases slowly with the increasing of laser energy, and micro-hardness of the laser treated specimens was improved significantly.

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Periodical:

Key Engineering Materials (Volume 464)

Pages:

506-509

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.464.506

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Online since:

January 2011

Authors:

W. Zhu, Jian Zhong Zhou, M Wang, Shu Huang, Deng Hui Wei, Yu Jie Fan

Keywords:

Micro-Electromechanical System (MEMS), Microhardness, Micro-Morphology, Micro-Scale Laser Shock Peening

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