Interfacial Reaction of Ni (P)-Sn Coating on Magnesium

Abstract:

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Hot dip tin coating was obtained on AZ91D magnesium alloy surface, and interfacial reactions between Sn coating and electroless Ni-P plating was studied. The results show: after 220±5°C, 2h diffusion, the intermetallic compounds possessed corresponding thickness, and Ni3P layer along the interface acted as a good diffusion barrier between Sn and Ni. When Ni3Sn4 spread to the surface, microcracks were observed on the surface. Corrosion resistance of Ni(P)-Sn coating before and after diffusion was investigated with polarization curves. The results show: Ni(P)-Sn coating significantly enhance the corrosion potential of base material, but after the Ni3Sn4 growth to the surface, it caused electrochemical corrosion and decreased the corrosion resistance.

Info:

Periodical:

Edited by:

Long Chen, Yongkang Zhang, Aixing Feng, Zhenying Xu, Boquan Li and Han Shen

Pages:

514-517

DOI:

10.4028/www.scientific.net/KEM.464.514

Citation:

X. L. Ge et al., "Interfacial Reaction of Ni (P)-Sn Coating on Magnesium", Key Engineering Materials, Vol. 464, pp. 514-517, 2011

Online since:

January 2011

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$35.00

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