Interfacial Reaction of Ni (P)-Sn Coating on Magnesium

Xiao Lan Ge; Cai Jun Wang; Zhi Chao Chen; Bing Zeng; Duo Wei

doi:10.4028/www.scientific.net/KEM.464.514

Paper Titles

Research on the Surface Roughness of Dry Cutting Different Levels of Austempering Ductile Iron (ADI)
p.496

Finger Milling-Cutter NC Generating Spiral Bevel Gear Tooth Surfaces & its Machining Simulation
p.501

Experimental Study of Micro-Scale Laser Shock Peening on Copper Foils
p.506

Experiment Study on Nd: YAG Pulsed Laser Cutting Carbon Fibers Composites
p.510

Interfacial Reaction of Ni (P)-Sn Coating on Magnesium
p.514

Numerical Analysis the Tibological Performance of a Laser Surface Textured Mechanical Seal
p.518

The Software Development of Double-Beam Centroid Distance Measurement System in Laser Cladding Forming Process
p.524

Effect of Volume Fraction of Nanoparticles to the Convective Heat Transfer of Nanofluids
p.528

Investigation of Laser Shock Processing on the Key Weld Zone of Offshore Platform
p.532

HomeKey Engineering MaterialsKey Engineering Materials Vol. 464Interfacial Reaction of Ni (P)-Sn Coating on...

Interfacial Reaction of Ni (P)-Sn Coating on Magnesium

Abstract:

Hot dip tin coating was obtained on AZ91D magnesium alloy surface, and interfacial reactions between Sn coating and electroless Ni-P plating was studied. The results show: after 220±5°C, 2h diffusion, the intermetallic compounds possessed corresponding thickness, and Ni3P layer along the interface acted as a good diffusion barrier between Sn and Ni. When Ni3Sn4 spread to the surface, microcracks were observed on the surface. Corrosion resistance of Ni(P)-Sn coating before and after diffusion was investigated with polarization curves. The results show: Ni(P)-Sn coating significantly enhance the corrosion potential of base material, but after the Ni3Sn4 growth to the surface, it caused electrochemical corrosion and decreased the corrosion resistance.

You might also be interested in these eBooks

Functional Manufacturing Technologies and Ceeusro II

View Preview

Info:

Periodical:

Key Engineering Materials (Volume 464)

Pages:

514-517

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.464.514

Citation:

Cite this paper

Online since:

January 2011

Authors:

Xiao Lan Ge, Cai Jun Wang, Zhi Chao Chen, Bing Zeng, Duo Wei

Keywords:

Diffusion, Interface, Magnesium Alloy, Ni₃Sn₄

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] J.C. BENEDYK: Magnesium advances in automotive applications (Light Metal Age, America 2005).

Google Scholar

[2] D. LETZIG, J. SWIOSTEK, J. BOHLEN, P.A. BEAVEN, K.U. KAINER: Wrought magnesium alloys for structural applications (Materials Science and Technology, China 2008).

DOI: 10.1179/174328407x213080

Google Scholar

[3] D. GUR, M. BAMBERGER: Reaction isothermal solidification in the Ni-Sn system (Acta mater, America 1998).

Google Scholar

[4] H.H. SAO, D.J. ZHANG, X.Y. JIANG: Factors Influencing Plating Rate of Electroless Ni-P Plating and Optimization of the Plating Process (Materials Protection, China 2008).

Google Scholar

[5] J.T. LU, Q.Y. XU, G. KONG. Application of Hot- Dip Aluminizing Technique Vo1. (2006), pp.236-240.

Google Scholar

[6] J.W. YOON, S.W. KIM, S.B. JUNG: Effect of reflow time on interfacial reaction and shear strength of Sn–0. 7Cu solder/Cu and electroless Ni–P BGA joints (Journal of Alloys and Compounds, Holland 2004).

DOI: 10.1016/j.jallcom.2004.05.009

Google Scholar

[7] Q.N. ZHU, L LUO , K. XIAO , L.G. DU: Ni as diffusion barriers between eutectic Sn Ag solder and Cu (The Chinese Journal of Nonferrous Metals, China 2000).

Google Scholar

[8] C.Y. LIN, C.C. JIAO, C. LEE, Y.W. YEN: The effect of nonreactive alloying elements on the growth kinetics of The intermetallic compounds between liquid Sn-based eutectic solders sand Ni substrates (Journal of Alloys and Compounds, Holland 2007).

DOI: 10.1016/j.jallcom.2006.09.029

Google Scholar