Thermal Stress Analysis of a Multi-Layered Structure

Abstract:

Analytical model based on the Bernoulli beam theory and strain compatibility conditions at the interfaces between the two layers have been developed to predict the distribution of thermal stresses within the multi-layered structure due to the mismatch of thermal expansion. The closed-form solution of thermal stresses related to the material properties and geometry were obtained. It is useful to provide a simple and efficient analytical model, so that the stress level in the layers can be accurately estimated. The analytical results are compared with finite element results. Good agreement demonstrates that the proposed approach is able to provide an efficient way for the calculation of the thermal stresses.

• Periodical: Key Engineering Materials (Volumes 467-469)
• Pages: 275-278
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.467-469.275
• Online since: February 2011
• Authors: Shiuh Chuan Her, Chin Hsien Lin
• Keywords: Bernoulli Beam Theory, Multi-Layered Structure, Thermal Stress

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