Estimation of Curing Profile's Parameters for Flip Chip Packaging Using DSC and TGA

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This paper presents the method to estimate curing profile's parameters for curing process of Moisture Resistance Cyanate Ester (MRCE) based underfill used in Flip Chip Ceramic Ball Grid Array (FC-CBGA). The two steps curing profile was found to eliminate voids formation in underfill during curing process. The important parameters in two steps curing profile such as first fixed temperature and duration of second temperature rise were estimated by superimposed of cure initiation curve and weight percentage loss curve of underfill epoxy material. Differential Scanning Calorimeter (DSC) analysis was carried out to characterize the cure kinetics reaction of underfill epoxy and produced the cure initiation curve. Thermal Gravimetric Analysis (TGA) was performed to characterize the weight loss of underfill and produced the weight loss curve. It was estimated that the first fixed temperature and duration of second temperature rise for two steps curing profile were 100 oC and 60-80 minutes respectively. The simulation experiment was conducted to verify the profile and no voids formation observed along this curing process.

Info:

Periodical:

Key Engineering Materials (Volumes 467-469)

Edited by:

Dehuai Zeng

Pages:

950-955

DOI:

10.4028/www.scientific.net/KEM.467-469.950

Citation:

Z. Kornain et al., "Estimation of Curing Profile's Parameters for Flip Chip Packaging Using DSC and TGA", Key Engineering Materials, Vols. 467-469, pp. 950-955, 2011

Online since:

February 2011

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Price:

$35.00

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