Prediction of Resin Thermal Behavior during Curing Process Based on Kamal-Ryan Model

Abstract:

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This paper was devoted to the numerical simulation the resin curing process. Anisotropic conduction was considered in the model. And Kamal-Ryan model was used to describe the curing kinetics of the resin. The general purpose finite element code ABAQUS was used in conjunction with its user subroutine UMATHT to solve the heat conduction equation and the kinetic model, simultaneously. Then corresponding experiment was carried out to validate the model. Finally, rate-of-cure, temperature and state-of-cure were analyzed during the curing process.

Info:

Periodical:

Key Engineering Materials (Volumes 474-476)

Edited by:

Garry Zhu

Pages:

137-142

DOI:

10.4028/www.scientific.net/KEM.474-476.137

Citation:

W. X. Tang et al., "Prediction of Resin Thermal Behavior during Curing Process Based on Kamal-Ryan Model", Key Engineering Materials, Vols. 474-476, pp. 137-142, 2011

Online since:

April 2011

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Price:

$35.00

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