The Non-Destructive Measurement Instrument for Material Thickness

Shou Cheng Ding; Wen Hui Li; Gui Ci Yuan

doi:10.4028/www.scientific.net/KEM.480-481.415

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 480-481The Non-Destructive Measurement Instrument for...

The Non-Destructive Measurement Instrument for Material Thickness

Abstract:

In a variety of materials, the ultrasonic propagation velocity is different. Using ultrasonic reflection principle in the material, the measuring instrument detected the thickness of the measured object. AT89C51 microcontroller as the system core, with ultrasonic probe, transmitter circuit, receiver circuit, counter circuit, LCD display circuit together, completed the measurement of materials thickness. The measurement range was up to a 1.2 ~ 200mm. Practice shows that the instrument is low cost, high speed, high precision, reliability, adaptability, etc. So it has broad application prospects.

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Periodical:

Key Engineering Materials (Volumes 480-481)

Pages:

415-420

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.480-481.415

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Online since:

June 2011

Authors:

Shou Cheng Ding, Wen Hui Li, Gui Ci Yuan

Keywords:

AT89C51 Microcontroller, Material Thickness, Nondestructive Testing (NDT), Ultrasonic

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References

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