Design and Simulation of a Differential and Decoupled Micromachined Gyroscope
In this paper, a differential and decoupled micromachined gyroscope fabricated by through-etching the silicon substrate anodically bonded on the glass substrate was presented. The decoupled structure can make the sense mode frequency match with the drive mode frequency and reduce the quadrature error. The sensitivity is further improved by differential detection using antiphase oscillation of double masses along the drive axis. Finite-element simulation is performed with ANSYS software to analyze the vibration mode. The device employs silicon-on-glass gyroscope sensor chip processed with Deep Reactive Ion Etching (DRIE) and glass-silicon anodic bonding. Then it is tested at atmospheric pressure. Drive mode and sense mode are obtained as 2015 Hz and 1957 Hz which are closed to the simulated ones. Q factor of the drive and sense mode also can be gained as 56 and 3.4.
Y. Liu et al., "Design and Simulation of a Differential and Decoupled Micromachined Gyroscope", Key Engineering Materials, Vol. 483, pp. 674-678, 2011