Paper Titles

Preface, Sponsors and Committees

Polishing Silicon Wafers with the Nanodiamond Abrasive Tools Prepared by Sol-Gel Technique
p.1

Calculation of Effective Ground Depth of Cut by Means of Grinding Process Model
p.7

Grindability of Single Crystal Sapphire in Medical Use and the Scheme of Forming Highly Precise Spherical Heads
p.13

Error Size of the Helix (screw) Groove by Grinding
p.19

Influence of the Corrosion Surrounding on Surface Quality of Grounded Hardened Steels
p.25

New Laser Machine Tools for Processing Carbon Fibre Reinforced Plastic (CFRP)
p.30

Advanced Fiber Laser Perforation Technology for Thermoplastic Pre-Preg Material
p.36

Laser Assisted Micro Grinding of High Strength Materials
p.44

HomeKey Engineering MaterialsKey Engineering Materials Vol. 496Preface, Sponsors and Committees

Preface, Sponsors and Committees

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Key Engineering Materials (Volume 496)

Online since:

December 2011

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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