Polishing Silicon Wafers with the Nanodiamond Abrasive Tools Prepared by Sol-Gel Technique

Guang Qiu Hu; Jing Lu; Xi Peng Xu

doi:10.4028/www.scientific.net/KEM.496.1

Paper Titles

Preface, Sponsors and Committees

Polishing Silicon Wafers with the Nanodiamond Abrasive Tools Prepared by Sol-Gel Technique
p.1

Calculation of Effective Ground Depth of Cut by Means of Grinding Process Model
p.7

Grindability of Single Crystal Sapphire in Medical Use and the Scheme of Forming Highly Precise Spherical Heads
p.13

Error Size of the Helix (screw) Groove by Grinding
p.19

Influence of the Corrosion Surrounding on Surface Quality of Grounded Hardened Steels
p.25

New Laser Machine Tools for Processing Carbon Fibre Reinforced Plastic (CFRP)
p.30

Advanced Fiber Laser Perforation Technology for Thermoplastic Pre-Preg Material
p.36

Laser Assisted Micro Grinding of High Strength Materials
p.44

HomeKey Engineering MaterialsKey Engineering Materials Vol. 496Polishing Silicon Wafers with the Nanodiamond...

Polishing Silicon Wafers with the Nanodiamond Abrasive Tools Prepared by Sol-Gel Technique

Abstract:

In this paper, in order to avoid aggregate of nanodiamonds and reduce the damage problem caused by the hard abrasives during polishing, a kind of ultra-fine nanodiamond abrasive polishing pad was fabricated by means of sol-gel technology. The polishing pad was then used to polish silicon wafer on a nano-polishing machine. The surface morphologies and roughness were measured by both optical microscope and atomic force microscope (AFM). It is found that it was easy to machine the silicon wafer to mirror surface after polishing with the nanodiamond pad. And the surface roughness of the silicon wafer was reduced to 0.402 nm.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Key Engineering Materials (Volume 496)

Pages:

1-6

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.496.1

Citation:

Cite this paper

Online since:

December 2011

Authors:

Guang Qiu Hu, Jing Lu, Xi Peng Xu

Keywords:

Nanodiamond, Silicon Wafer, Sol-Gel Polishing Pad

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] G.S. May, S. M Sze, Fundamentals of Semiconductor Fabrication, Wiley, New York, (2004) 1.

Google Scholar

[2] H. Huang, B.L. Wang, Y. Wang, Characteristics of Silicon Substrates Fabricated Using Nanogrinding and Chemo-mechanical-grinding, Materials Science and Engineering A. 479 (2008) 373-379.

DOI: 10.1016/j.msea.2007.06.061

Google Scholar

[3] Y. W Zhu, X. Y Xu, ZH. J Feng, Surface Modification and Dispersion of Nanodiamond in Clean Oil, China Particuology. 2 (2004) 132-134.

DOI: 10.1016/s1672-2515(07)60039-6

Google Scholar

[4] Y. W Zhu, X.Y. Xu, ZH.J. Feng, Dispersion of Nanodiamond in Aqueous system, Diamond& Abrasive Engineering. 136 (2003) 26-29.

Google Scholar

[5] Y.W. Zhu , B. Ch. Wang, X.Y. Xu, Dispersion of Nanodiamond and Ultra-Fine Polishing of Quartz Wafer, China Particuology. 2 (2004) 153-156.

DOI: 10.1016/s1672-2515(07)60046-3

Google Scholar

[6] G.A. Chigandova, V.A. Boonger, A.S. Chiganov, Electrophoretic Technology of Hydrosols of Ultra-dispersed Diamond and Modification of its Surface, Colloid J. 55 (1993) 774-775.

Google Scholar

[7] A.P. Votmyakovskii, V. Yu. Dolmatov, V.V. Klyubin, Structure and Sedimentation Stability of Suspension of Detonation Nanodiamonds in Nonaqueous Liquid Media, Sverkhtv Mater. 64 (2000) 64-71.

Google Scholar

[8] Ch.A. Chao, Sh. Sh. Li, Sh.R. Lee, Mechano-chemical polishing of silicon wafer, Journal of Materials Processing Technology. 140 (2003) 373-378.

Google Scholar

[9] Ch.Y. Shi, P.L. Tso, C.S. James, Analysis of Fixed Abrasive Pads with a Nano-sized Diamond for Silicon Wafer Polishing, Advanced Materials Research. 76-78 (2009) 410-415.

DOI: 10.4028/www.scientific.net/amr.76-78.410

Google Scholar

[10] J. Liu, Y.Q. Yu, X.P. Xu, Fabrication of Ultra-fine Abrasive Polishing Pads by Gel Technique, Materials Science forum. 532-533 (2006) 468-471.

DOI: 10.4028/www.scientific.net/msf.532-533.468

Google Scholar

[11] J. Liu, X.P. Xu, Fabrication of Ultra-fine Diamond Abrasive Tools by Sol-gel, Materials Science Forum. 471-472 (2004) 426-430.

DOI: 10.4028/www.scientific.net/msf.471-472.426

Google Scholar