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HomeKey Engineering MaterialsKey Engineering Materials Vol. 499Status and Trends of Fixed Abrasive Polishing on...

Status and Trends of Fixed Abrasive Polishing on Semiconductor

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Abstract:

The necessity of fixed abrasive CMP in polishing semiconductor materials processing was analyzed. Compared the shortcomings of traditional free abrasive polishing with the advantages of fixed abrasive polishing, the applications of fixed abrasive polishing technology in semiconductor processing were described. A variety of fixed abrasive polishing pad production methods were introduced. The development trend of fixed abrasive polishing was prospected.

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Periodical:

Key Engineering Materials (Volume 499)

Pages:

390-396

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.499.390

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Cite this paper

Online since:

January 2012

Authors:

Y. Zhao, Dun Wen Zuo, Yu Li Sun

Keywords:

Fixed-Abrasive, Polishing, Polishing Pad, Semiconductor Material

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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