The Numerical Simulation for Thermal Deformation in Grinding Hardening Thin Workpiece

Ying Zhang; Pei Qi Ge; Lei Zhang; Jing Liang Jiang

doi:10.4028/www.scientific.net/KEM.501.500

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HomeKey Engineering MaterialsKey Engineering Materials Vol. 501The Numerical Simulation for Thermal Deformation...

The Numerical Simulation for Thermal Deformation in Grinding Hardening Thin Workpiece

Abstract:

The high temperature in grinding hardening induces workpiece thermal deformation. The thermal deformation causes a concavity on the ground profile and affects the grinding hardening depth. The paper uses ANSYS thermo-mechanical coupling module to simulate the thermal deformation in grinding hardening. The workpiece profile by simulated is compared with the test result.

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Periodical:

Key Engineering Materials (Volume 501)

Pages:

500-504

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.501.500

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Online since:

January 2012

Authors:

Ying Zhang, Pei Qi Ge, Lei Zhang, Jing Liang Jiang

Keywords:

ANSYS, Grinding Hardening, Thermal Deformation

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References

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