Simulation of Hybrid Joining Technologies Using the Example of Clinch-Bonding

Abstract:

In this paper a method for simulating hybrid joining processes will be described. The simulation of joining processes with adhesives is necessary because mechanical joining processes are mostly applied in combination with adhesives. However, the simulation of hybrid joining processes is not state of the art. The reason is the Fluid-Structure-Interaction between the adhesive and the plates, which occurs due to the highly uneven stiffness of the materials. This problem is minimized by the use of an elastic‑plastic material model and a Lagrange formulation for the adhesives. The parameters for the material formulation and the friction have been evaluated by conducting a design of experiment. The correlation between simulation and experiment is ensured by an evaluation of the geometrical distribution of the adhesives within the clinch‑bonding point and the force-displacement diagram. Considering the very low computing time of approximately thirty minutes, the obtained result is very satisfying.

• Periodical: Key Engineering Materials (Volumes 504-506)
• Pages: 777-782
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.504-506.777
• Online since: February 2012
• Authors: Sirous Etemadi, Ortwin Hahn, Karl Roll
• Keywords: Clinch-Bonding, Finite Element Method (FEM), Fluid Structure Interaction (FSI), Hybrid Joining Technology, Light-Weight Design, Mechanical Joining, Multi-Material Mix, Simulation

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DOI: 10.3139/9783446443532.fm