Laser Induced Backside Dry Etching of BK-7 and Quartz in Vacuum

Article Preview

Abstract:

Laser Induced Plasma Assisted Ablation (LIPAA) has been used to carry out back side dry etching/ablation of different optical glasses under vacuum. It is observed that etching depth increases with decrease in target-substrate gap and becomes maximum (50 μm) at zero gap size for steel-quartz pair. The maximum ablation depth for brass-quartz pair was 25 μm. The effects of laser power on etching depth and laser scan speed has also been reported.

You might also be interested in these eBooks

Info:

Periodical:

Key Engineering Materials (Volumes 510-511)

Pages:

261-264

Citation:

Online since:

May 2012

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2012 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] J. M. Lee et al, Appl. Phys. A 70 (2000) 561.

Google Scholar

[2] K. Sugioka and K. Midorikawa, RIKEN Review No. 32 (2001) 36.

Google Scholar

[3] Z. Jie et al. Applied Phys. A. 67 (1998) 499.

Google Scholar

[4] Y. Hanada et al. Applied Phys. A. 79 (2004) 1001.

Google Scholar

[5] Z. Jie et al. Applied Phys. A. 69 (1999) S879.

Google Scholar

[6] A.H. Hamdani et al. Key Engineering Materials, 442 (2010) 172.

Google Scholar

[7] Z. Jie et al. Applied Phys. A. 67 (1998) 545.

Google Scholar