Research and Simulation of LTE Technology in Manufacturing Metal Part

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Laminated templates electro-deposition (LTE) is a new manufacturing technique aimed at a highly precise and low-cost fabrication of metallic structures through a number of planar template-patterned depositing. The ability to control deposit surface non-uniformity in each planar depositing has been proved a key to this technique. Correspondingly a 3D simulation for electrical field has been modeled using finite-element method in line with the real experimental conditions. The mapped contour of simulating proved the variedly distributed electrical field and basically match with experimental results. Three groups of LTE test by direct current, pulse and double-pulse current are introduced and assessed in term of their effect to improve uniformity. By comparison, pulse application, especially double-pulse offered a better deposit quality with optimized parameters including pulse width, frequency, working time and off time. A bulk of 10-15layers copper parts, section size 20mm×20mm and 4-6mm thick were produced using the modified parameters.

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52-57

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August 2012

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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[1] J.A. McGeough, M.C. Leu, K.P. Rajurkar, A.K.M. De Silva and Q. Liu: Manufacturing Technology, Vol. 50 (2001) No. 2, p.500.

Google Scholar

[2] G.N. Li, C.J. Huang, L. LUO, M. GUO, Z.Y. YU and J. Yu: Microfabrication Technology, Vol. 6 (2006), pp.1-5.

Google Scholar

[3] H.J. Liu, L.Q. Du, J. Qin and S.M. Zhu: Chinese Journal of Sensors and Actuators, Vol. 19 (2006) No. 5, p.1481.

Google Scholar

[4] K. Wang, D. Zhu and J.M. Yang: Aviation Precision Manufacturing Technology, VOl. 40 (2004) No. 6, pp.17-19.

Google Scholar

[5] C.Q. Liu: Machine Tool and Hydraulics, Vol. 3 (2003), p.233.

Google Scholar

[6] H.H. Yang and S.W. Kang: International Journal of Machine Tools and Manufacture, Vol. 40 (2000) No. 7, p.1071.

Google Scholar

[7] K. S. Chen and G. H. Evans: Microsystem Technologies, Vol. 10(2004), p.447.

Google Scholar

[8] M.S. Chandrasekar and Malathy Pushpavanam: Electrochemical Acta, Vol. 53 (2008) No. 8, p.3315.

Google Scholar

[9] N. S. Qu, K. C. Chan and D. Zhu: Surface and Coatings Technology, Vol. 91 (1997) No. 3, p.223.

Google Scholar