Adhesion Strength of Electroless Copper Plated Layer on Fluoropolymer Surface Modified by Medium Pressure Plasma

Kento Ooka; Yuto Yamamoto; Yasuhiro Hara; Nobuyuki Zettsu; Kazuya Yamamura

doi:10.4028/www.scientific.net/KEM.523-524.262

Paper Titles

Novel System Technology for Trepanning a Laser Beam at Arbitrary Developments of Angle of Incidence and Lateral Focus Position
p.238

Thermal Conductivity of Metal Powder and Consolidated Material Fabricated via Selective Laser Melting
p.244

A Study on Driven-Type Rotary Cutting for Finish Turning of Carburized Hardened Steel
p.250

Development of a New Ultra-Precision Magnetic Abrasive Finishing Process
p.256

Adhesion Strength of Electroless Copper Plated Layer on Fluoropolymer Surface Modified by Medium Pressure Plasma
p.262

Material Removal Rate Control in Open-Air Type Plasma Chemical Vaporization Machining Using Optical Actinometry
p.267

Quadruple Stacked Elliptical Supermirror Device for One Dimensional Neutron Focusing
p.272

A Simulation Study on Figure Error Correction Using Near-Gaussian Removal Function in Numerical Controlled Local Wet Etching
p.276

Analysis of Discharge Current in Wire-EDM Considering Electromagnetic Fields in and between Electrodes
p.281

HomeKey Engineering MaterialsKey Engineering Materials Vols. 523-524Adhesion Strength of Electroless Copper Plated...

Adhesion Strength of Electroless Copper Plated Layer on Fluoropolymer Surface Modified by Medium Pressure Plasma

Abstract:

We demonstrated high adhesive fluoropolymer/copper interface through combination of atmospheric pressure plasma with liquid phase self-assembly. However, there are some disadvantages in atmospheric pressure plasma technique, such as small processing area due to the localized plasma and high gas temperature. Medium pressure plasma process has some advantages over atmospheric pressure plasma systems. A large plasma volume and low gas temperature, available for surface treatment of polymer material, can be easier obtained at medium pressure than at atmospheric pressure, which can result in a higher overall productivity. In this paper, we investigated the adhesion strength of electroless copper plated layer formed on poly(tetrafluoroethylene-co-perfluoropropyl vinyl ether) (PFA) surface modified by combination of medium pressure helium plasma irradiation and aminated acrylic polymer grafting. The 90° peel test result for copper plating film formed on the treated PFA films showed the adhesion strength of 0.44 N/mm without increasing the surface roughness.