Numerical Modeling and Digital Image Correlation Strain Measurements of Coated Metal Sheets Submitted to Large Bending Deformation

Laurent Duchêne; Amine Ben Bettaieb; Victor Tuninetti; Anne Marie Habraken

doi:10.4028/www.scientific.net/KEM.554-557.2424

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 554-557Numerical Modeling and Digital Image Correlation...

Numerical Modeling and Digital Image Correlation Strain Measurements of Coated Metal Sheets Submitted to Large Bending Deformation

Abstract:

The recently developed SSH3D solid-shell element [1], which is based on the Enhanced Assumed Strain (EAS) and the Assumed Natural Strain (ANS) techniques, is utilized for the modeling of a severe bending sheet forming process. To improve the element's ability to capture the through thickness gradients, a specific integration scheme was developed. In this paper, the performances of this element for the modeling of the T-bent process were assessed thanks to comparison between experimental and numerical results in terms of the strain field at the outer surface of the sheet. The experimental results were obtained by Digital Image Correlation. It is shown that a qualitative agreement between experimental and numerical results is obtained but some numerical parameters should be optimized to improve the accuracy of the simulation predictions. In this respect, the influence of the penalty coefficient of the contact modeling was analyzed.

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Periodical:

Key Engineering Materials (Volumes 554-557)

Pages:

2424-2431

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.554-557.2424

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Online since:

June 2013

Authors:

Laurent Duchêne, Amine Ben Bettaieb, Victor Tuninetti, Anne Marie Habraken

Keywords:

Coated Metallic Sheet, Digital Image Correlation (DIC), Finite Element Method (FEM), Sheet Forming, Solid-Shell Finite Element

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References

[1] L. Duchêne, A. Ben Bettaieb and A. M. Habraken, Assessment of the Enhanced Assumed Strain (EAS) and the Assumed Natural Strain (ANS) techniques in the mechanical behavior of the SSH3D solid-shell element, in the Proceedings of the international conference COMPLAS XI, 2011.

DOI: 10.4028/www.scientific.net/kem.504-506.913

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