MD Simulation of MEMS “Stiction” and “Snap-Back” Phenomena

Wen Chao Tian; Lai Qiang Zhao

doi:10.4028/www.scientific.net/KEM.562-565.1177

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 562-565MD Simulation of MEMS “Stiction” and “Snap-Back”...

MD Simulation of MEMS “Stiction” and “Snap-Back” Phenomena

Abstract:

Aiming to explain phenomena of “stiction” and “snap-back”, a ball-surface adhesion is simulated with molecular dynamics (MD) based on multi-body EAM potential function. Surface atoms “summon up” and migrate, which lead to the phenomenon of “stiction”. The migration velocity of interface atom is not consistent. Some atoms migrate too fast, which lead to the phenomenon of “snap-back”. The “Snap-back” phenomenon appears twice during the adhesion process. A “neck-separation” phenomenon is found. The adhesive force in the separation process obviously lagged the adhesive force in the contact process, which shows there is energy loss during the adhesion process. The curve of adhesion deformation is simulated finally, and compared with relevant results.

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Periodical:

Key Engineering Materials (Volumes 562-565)

Pages:

1177-1181

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.562-565.1177

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Online since:

July 2013

Authors:

Wen Chao Tian, Lai Qiang Zhao

Keywords:

Molecule Dynamic, Neck-Separation, Snap-Back, Stiction

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