Magnetron Sputtering Ni-Cr Alloy Thin Film Resistance Temperature Characteristic Study

Li Tang; Dong Ping Hu

doi:10.4028/www.scientific.net/KEM.562-565.832

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 562-565Magnetron Sputtering Ni-Cr Alloy Thin Film...

Magnetron Sputtering Ni-Cr Alloy Thin Film Resistance Temperature Characteristic Study

Abstract:

Based on microelement manufacturing, semiconductor lithography technologies, The sensor chips fabricated to be small volume, high reliability, easy mass production, low cost, can resist to bad environment. In thin film pressure sensor chip, Ni-Cr alloy thin film is the key part, mostly influence the main electrical characteristics of the film pressure sensor chips. The resistance temperature characteristics changes on account of different proportions of Ni-Cr alloys. In this paper, two different proportions of Ni-Cr alloys were deposited and heat treated, the TCR of the alloys were tested, the causes were analyzed.

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Periodical:

Key Engineering Materials (Volumes 562-565)

Pages:

832-836

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.562-565.832

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Online since:

July 2013

Authors:

Li Tang, Dong Ping Hu

Keywords:

Magnetron Sputtering, Ni-Cr Alloy Thin Film, Resistance Temperature Characteristics

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