Nanoindentation of Thin Copper Coatings

Abstract:

The structure of interest is a thin, metallic coating of fcc copper, of thickness down to a few nanometers only, resting on a stiffer substrate. The elastic and plastic properties of the thin coating using nanoindentation under different geometrical features such as size of the indenter and coating thickness are determined. The force-displacement curve is monitored during indentation and the precise conditions for the occurrence of so called pop-ins during loading are investigated. To simulate the nanoindentation process, a molecular dynamics approach is used, where an infinitely stiff indenter is pushed into the coating under displacement control. The coating is modeled as a thin rectangular plate, with the bottom atom layers locked from movement, simulating the stiffer substrate, and periodic boundary conditions in the plane of the plate are applied.

• Periodical: Key Engineering Materials (Volumes 592-593)
• Pages: 417-420
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.592-593.417
• Online since: November 2013
• Authors: Per Hansson, Maria Jansson
• Keywords: Molecular Dynamic (MD), Nanoindentation, Thin Coating

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