Design and Fabrication of a Micro Spring with Steel Structures for the Microtensile Testing of Thin Films

Article Preview

Abstract:

A novel micro spring with steel structures is described here. It can be fit into a specially designed microtensile apparatus, which is capable of carrying out a series of tests on micron scale freestanding thin films. This method is suitable for thin metal films or polymer layers with large strain and can be applied to samples with different thicknesses. The novel fabrication method uses the conventional lithography and electrochemical metal etching techniques. A single photomask is used to define the whole structure, resulting in a simple and inexpensive fabrication process. The method proposed here is promising for the low cost fabrication of micro spring based on steel. A micro spring of 100μm wide, 100μm thick, with 200μm diametric of the semicircle and 6 turns was prepared by this method; the elasticity of the spring is 147.3N / m. A gold wire was measured by this micro spring. The young's modulus and ultimate tensile strength of the gold wire were 30Gpa and 120Mpa, respectively.

You might also be interested in these eBooks

Info:

Periodical:

Key Engineering Materials (Volumes 609-610)

Pages:

39-44

Citation:

Online since:

April 2014

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2014 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] Neugebauer C.A.: Tensile properties of thin, evaporated Gold Films, J. Appl. Phys., 1960, 31, (6), pp.1096-1101.

DOI: 10.1063/1.1735751

Google Scholar

[2] Brotzen F. R.: Mechanical testing of thin films, Int. Mater. Rev., 1994, 39, (1), pp.24-45.

Google Scholar

[3] Haque M.A., Saif M.T.A.: A Review of MEMS-Based Microscale and Tensile and Bending Testing Nanoscale, Experimental Mechanics, 2003, 43, (3), pp.248-255.

DOI: 10.1007/bf02410523

Google Scholar

[4] Ogawa H., Suzuki K., Kaneko S., Nakano Y., Ishikawa Y., Kitahara T.: Tensile testing of microfabricated thin films, 1997, Microsystem Technologies , pp.117-121.

DOI: 10.1007/s005420050067

Google Scholar

[5] Tsuchiya T., Shikida M., Sato K.: Tensile testing system for sub-micrometer thick films, Sensors Actuators A, 2002, 97-98, pp.492-496.

DOI: 10.1016/s0924-4247(01)00862-7

Google Scholar

[6] Lu S., Dikin D.A., Zhang S., Fisher F.T., Lee J., Ruoff R.S.: Realization of nanoscale resolution with micromachined thermally actuated testing stage, Rev Sci Instrum, 2004, 75, (6), pp.2154-2162.

DOI: 10.1063/1.1710703

Google Scholar

[7] Liu R., Wang H., Li X., Ding G., Yang C.: A microtensile method for measuring mechanical properties of MEMS materials, J. of Micromech. and Microeng., 2008, 18, p.065002.

DOI: 10.1088/0960-1317/18/6/065002

Google Scholar

[8] Datta M., Landolt D.: Fundamental aspects and applications of electrochemical microfabrication, Electrochim. Acta, 2000, 45, p.2535–2558.

DOI: 10.1016/s0013-4686(00)00350-9

Google Scholar