Measurement of the Thermal Conductivity of Polydimethylsiloxane Polymer Using the Three Omega Method

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Polydimethylsiloxane (PDMS) has widely appeared in different electronic and medical applications. The knowledge of the thermal properties of PDMS and especially its thermal conductivity is required while processing PDMS to design a particular device. In this paper measurement of the thermal conductivity of PDMS using the three omega method is presented at different temperatures. The three omega method has been chosen because of its ease of use and accuracy. It requires the fabrication of metallic lines which act as heaters and thermometers on the surface of the material under test. A different procedure is introduced in this paper through which the metallic lines are embedded in the surface of PDMS. Experimental results are then compared to Cahill's approximate solution and to the results obtained by numerical simulations using a finite element method.

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259-266

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May 2014

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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[1] N. Tiercelin, P. Coquet, R. Sauleau, V. Senez and H. Fujita, Polydimethylsiloxane membranes for millimeter-wave planar ultra-flexible antennas, J. Micromechanical Microengineering, Vol. 16, pp.2389-2395, (2006).

DOI: 10.1088/0960-1317/16/11/020

Google Scholar

[2] S. Hage-Ali, N. Tiercelin, P. Coquet, R. Sauleau, H. Fujita, V. Preobrazhensky, P. Pernod, A millimeter-wave microstrip antenna array on ultra-flexible micromachined polydimethylsiloxane (PDMS) polymer, IEEE Antennas and Wireless Propagation Letters, Vol. 8, pp.1306-1309, (2009).

DOI: 10.1109/lawp.2009.2037590

Google Scholar

[3] J. Kuncova-Kallio, J. Kallio Pasi, PDMS and its suitability for analytical microfluidic devices, Proceedings of the 28th IEEE EMBS Annual International Conference, pp.2486-2489, New York City, USA, Aug 30-Sept 3, (2006).

DOI: 10.1109/iembs.2006.260465

Google Scholar

[4] J. Cooper, M.G. Whitesides, Polydimethysiloxane as a material for fabricating microfluidic devices, Accounts of Chemical Research, Vol. 35, No. 7, pp.491-499, (2002).

DOI: 10.1021/ar010110q

Google Scholar

[5] J. W. Hong, T. Fuji, M. Seki, T. Yamamoto, I. Endo, Integration of gene amplification and capillary gel electrophoresis on a polydimethylsiloxane-glass hybrid microchip, Elecrophoresis, Vol. 22, pp.328-333, (2001).

DOI: 10.1002/1522-2683(200101)22:2<328::aid-elps328>3.0.co;2-c

Google Scholar

[6] C. Hassler, T. Boretius, T. Stieglitz, Polymers for Neural Implants, Journal of Polymer Science: Part B: Polymer Physics, Vol. 49, pp.18-33, (2011).

DOI: 10.1002/polb.22169

Google Scholar

[7] A. Dawson, M. Rides, J. Nottay, The effect of pressure on the thermal conductivity of polymer melts, Polymer Testing, Vol. 25, pp.268-275, (2006).

DOI: 10.1016/j.polymertesting.2005.10.001

Google Scholar

[8] K.T. Wojciechowski, R. Zybala, R. Mania, Application of DLC layers in 3-omega thermal conductivity method, Journal of Achievements in Material and Manufacturing Engineering, Vol. 37, pp.512-517, (2009).

Google Scholar

[9] J.L. Battaglia, C. Wiemer, M. Fanciulli, An accurate low-frequency model for the 3ω method, Journal of Applied Physics, Vol. 101, pp.104510-1, (2007).

DOI: 10.1063/1.2721389

Google Scholar

[10] D.G. Cahill, Thermal conductivity measurement from 30 to 750 K: the 3ω method, Review of Scientific Instruments, Vol. 61, pp.802-808, (1990).

DOI: 10.1063/1.1141498

Google Scholar

[11] D.E. Kline, Thermal conductivity studies of polymers, Journal of Polymer Science, Vol. 50, pp.441-450, (1961).

Google Scholar

[12] I.K. Moon, H. Jeong, S.I. Kwun, The 3ω technique for measuring dynamic specific heat and thermal conductivity of a liquid or solid, Review of Scientific Instruments, Vol. 67, pp.29-35, (1996).

DOI: 10.1063/1.1146545

Google Scholar

[13] H.S. Carslaw, J.C. Jaeger, Conduction of heat in solids, Oxford University Press, Oxford, p.193, (1959).

Google Scholar

[14] K.J. Lee, K.A. Fosser, R.G. Nuzzo, Fabrication of stable metallic embedded in Poly(dimethylsiloxane) and model applications in non-planar electronic and lab-on-a-chip device patterning, Advanced Functional Materials, Vol. 15, pp.557-566, (2005).

DOI: 10.1002/adfm.200400189

Google Scholar

[15] J. Hong, J. Lee, C.K. Hong, S.E. Shim, Effect of dispersion state of carbon nanotube on the thermal conductivity of poly(dimethylsiloxane) composites, Current Applied Physics, Vol. 10, pp.359-363, (2010).

DOI: 10.1016/j.cap.2009.06.028

Google Scholar

[16] C.E. Raudzis, F. Schatz, Extending the 3ω method for thin-film analysis to high frequencies, Journal of Applied Physics, Vol. 93, pp.6050-6055, (2003).

DOI: 10.1063/1.1569663

Google Scholar

[17] A. Jacquot, B. Lenoir, A. Dauscher, M. Stolzer, J. Meusel, Numerical simulation of the 3ω method for measuring the thermal conductivity, Journal of Applied Physics, Vol. 91, pp.4733-4738, (2002).

DOI: 10.1063/1.1459611

Google Scholar

[18] H. Wang, M. Sen, Analysis of the 3-omega method for thermal conductivity measurement, International Journal of Heat and Mass Transfer, Vol. 52, pp.2102-2109, (2009).

DOI: 10.1016/j.ijheatmasstransfer.2008.10.020

Google Scholar