Diffusion Mechanism and Kinetics of Diffusion Bonded Mg/Ni/Al Joint

Jian Zhang; Qiang Guo Luo; Qiang Shen; Lian Meng Zhang

doi:10.4028/www.scientific.net/KEM.616.286

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HomeKey Engineering MaterialsKey Engineering Materials Vol. 616Diffusion Mechanism and Kinetics of Diffusion...

Diffusion Mechanism and Kinetics of Diffusion Bonded Mg/Ni/Al Joint

Abstract:

Mg and Al were bonded successfully by means of diffusion bonding using Ni interlayer. The microstructure, diffusion mechanism and regulation of atom diffusion were investigated by means of scanning electron microscopy (SEM), X-ray diffraction (XRD) and electron probe microanalysis analysis (EPMA). The results showed that the joints consisted of Mg-Ni interface and Al-Ni interface, and there were Mg₂Ni formed in the Mg-Ni interface and Al₃Ni formed in the Al-Ni interface, respectively. Diffusion activation energy of Mg and Al were lower than that of Ni in the Mg-Ni and Al-Ni interface. The thickness (x) of Mg₂Ni and Al₃Ni can be expressed as x²=3.97×10^-4 exp (-139600/RT) (t-t₀) and x²=8.62×10^-3 exp (-174200/RT) (t-t₀) with heating temperature (T) and holding time (t).

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Periodical:

Key Engineering Materials (Volume 616)

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286-290

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https://doi.org/10.4028/www.scientific.net/KEM.616.286

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Online since:

June 2014

Authors:

Jian Zhang, Qiang Guo Luo*, Qiang Shen, Lian Meng Zhang

Keywords:

Diffusion Bonding, Diffusion Kinetics, Interface, Mg/Ni/Al Joint

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