Frequency Bandwidth Adjustment by Precision Post-Processing for a 0.78–0.95 THz Band SIS Mixer

Abstract:

In this study, we demonstrate a method for adjusting the frequency bandwidth of a Superconductor-insulator-superconductor (SIS) mixer device by controlling its thickness after microfabrication. We estimate the relationship between SIS mixer device thickness and frequency bandwidth using electromagnetic (EM) simulation. We propose an optimal method for the precision polishing of the back side of the device. We evaluate the noise temperature and measure the frequency bandwidth of SIS mixer devices with different thicknesses. This study presents the adjustment of the frequency bandwidth of a device through controlling its thickness after microfabrication. This technique may improve the yield of SIS mixer device mass production and support the construction of receivers for ultra-high frequencies such as Atacama Large Millimeter/Submillimeter Array (ALMA) Band 10.

• Periodical: Key Engineering Materials (Volume 643)
• Pages: 157-163
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.643.157
• Online since: May 2015
• Authors: Akihira Miyachi*, Takafumi Kojima, Yasunori Fujii, Masanori Takeda, Yoshinori Uzawa, Matthias Kroug, Takashi Noguchi
• Keywords: ALMA Band 10, Atacama Large Millimeter/Submillimeter Array (ALMA), Precision Backside Polishing, SIS Mixer, Terahertz Receiver

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