The Influence of Polyhedral Oligomeric Silsesquioxane on Heat Resistance and Curing Kinetics of Potting Materials

Jing Hui Fan; Hua Jing; Ju Ying Wu

doi:10.4028/www.scientific.net/KEM.645-646.416

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The Influence of Polyhedral Oligomeric Silsesquioxane on Heat Resistance and Curing Kinetics of Potting Materials
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HomeKey Engineering MaterialsKey Engineering Materials Vols. 645-646The Influence of Polyhedral Oligomeric...

The Influence of Polyhedral Oligomeric Silsesquioxane on Heat Resistance and Curing Kinetics of Potting Materials

Abstract:

The influence of polyhedral oligomeric silsesquioxane on heat resistance and curing kinetics of potting materials were studied. The results showed that POSS can promote the cure, but did not change the potting materials curing mechanism. The research results have important significance for improving the performance of potting materials in electronic products.