Investigation of Cold Pressure Welding: Cohesion Coefficient of Copper

Hans Christian Schmidt; Christoph Ebbert; Dmytro Rodman; Werner Homberg; Guido Grundmeier; Hans Jürgen Maier

doi:10.4028/www.scientific.net/KEM.651-653.1421

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 651-653Investigation of Cold Pressure Welding: Cohesion...

Investigation of Cold Pressure Welding: Cohesion Coefficient of Copper

Abstract:

Joining materials by forming is an interesting approach to the manufacture of hybrid (multi material) parts. By establishing a cold pressure weld between metallic surfaces, high quality joints with superior properties can be achieved. Reliable cold welding conditions are difficult to set up, however, since the weld initiation requires extraordinary clean, virtually sheer surfaces. Until today such conditions could only be achieved under a high vacuum conditions. Various studies on cold pressure welding reported that under vacuum welds can be established at significantly lower deformation than in a normal atmosphere. Since adverse deformation is currently needed in industrial cold pressure welding processes like the cold roll cladding of metal bands, a new process with in-line electrochemical surface treatment, is investigated. The ECUF process is intended to supply clean and thereby highly activated surfaces to the cold pressure welding process.This paper presents first results on the weld-ability of copper specimens with regard to the influence of the welding environment: air, argon and KCl solution. Butt welds were made by pressure welding of previously fractured specimens.

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Periodical:

Key Engineering Materials (Volumes 651-653)

Pages:

1421-1426

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.651-653.1421

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Online since:

July 2015

Authors:

Hans Christian Schmidt*, Christoph Ebbert, Dmytro Rodman, Werner Homberg, Guido Grundmeier, Hans Jürgen Maier

Keywords:

Argon, Ecuf, Kcl Solution, Partial Joining

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