Effect of Carbon Black Content and Molding Pressure on the Thermal Conductivity of SiC/Si Ceramic Composites

Abstract:

SiC/Si ceramic composites have been considered as promising candidate materials for heat exchanger due to their good thermal conductivity and corrosion resistance. In this work, the SiC/Si ceramic composites were fabricated by liquid silicon infiltration technique, and the effect of carbon black content and molding pressure on thermal conductivity of the composites was studied. With carbon black content increasing from 5 wt. % to 25 wt. %, the thermal conductivity increased from 42.36 W/(m·K) to 65.60 W/(m·K) when molding pressure was fixed as 50 MPa. With molding pressure increasing from 30 MPa to 110 MPa, the thermal conductivity of SiC/Si ceramic composites with 20 wt. % carbon black content increased firstly, and then decreased, obtaining a maximum thermal conductivity of 71.62 W/(m·K) under 90 MPa. The SiC/Si ceramic composites with an optimal thermal conductivity of 76.55 W/(m·K) at room temperature were obtained when carbon black content and molding pressure were 25 wt. %, 90 MPa, respectively.

• Periodical: Key Engineering Materials (Volume 655)
• Pages: 58-61
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.655.58
• Online since: July 2015
• Authors: Qi Song Li, Yu Jun Zhang*, Hai Bin Sun, Yan Xia Zhai, Chao He
• Keywords: Carbon Black Content, Molding Pressure, SiC/Si Ceramic, Thermal Conductivity

References

[1] Matthias Wilhelm， Silvia Werdenich， Werner Wruss. Infuence of resin content and molding pressure on the mechanical properties of SiC-Si composites with sub-micron SiC microstructures[J] Journal of the European Ceramic Society 21 (2001) 981-990. ）.

DOI: 10.1016/s0955-2219(00)00281-8

[2] Qing-Wei Huang, Li-Hui Zhu. High-temperature strength and toughness behaviors for reaction-bonded SiC ceramics below 1400゜C[J] Materials Letters 59 (2005) 1732– 1735.

DOI: 10.1016/j.matlet.2005.01.049

[3] Matthias Wilhelm, Martin Kornfeld， Werner Wruss. Development of SiC-Si Composites with Fine-grained SiC Microstructures[J] Journal of the European Ceramic Society 19 (1999) 2155-2163.

DOI: 10.1016/s0955-2219(99)00029-1

[4] G. A. Slack, Nonmetallic crystals with high thermal conductivity, J. Phys. Chem. Solids, 34(1973) 321-335.

DOI: 10.1016/0022-3697(73)90092-9

[5] G. Amirthan, A. Udayakumar, M. Balasubramanian. Thermal conductivity studies on Si/SiC ceramic composites, Ceram. Int., 37(2011) 423-426.

DOI: 10.1016/j.ceramint.2010.09.003

[6] H. Xia, J. Wang, J. Lin, G. Liu, G. Qiao. Thermal conductivity of SiC ceramic fabricated by liquid infiltrating molten Si into mesocarbon microbeads-based preform, Mater. Charact. 82 (2013) 1-8.

DOI: 10.1016/j.matchar.2013.04.011