Study on Anti-Adhesion Layers Using AFM for Nanoimprint Process

C.T. Pan; T.L. Yang; C.H. Chao; Z.K. Wang; P.R. Ni

doi:10.4028/www.scientific.net/KEM.661.128

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HomeKey Engineering MaterialsKey Engineering Materials Vol. 661Study on Anti-Adhesion Layers Using AFM for...

Study on Anti-Adhesion Layers Using AFM for Nanoimprint Process

Abstract:

This study investigates how to improve the anti-adhesion issues between Silicon mold and nanostructures of hard polydimethylsiloxane (H-PDMS). A Silicon mold with different depths and widths was made using a focused ion beam (FIB). During the soft-lithography molding process, anti-adhesion layers were needed between the Silicon mold and H-PDMS samples to prevent the de-molding failure caused by the adhesion issues between the interfaces. This study adopts three methods to deposit anti-adhesion layers, such as liquid immersion, vapor deposition, and fluorine-doped diamond-like carbon (F-DLC) film. Perfluorooctyl-trichlorosilane (PFOTCS) was used as a mold-releasing agent for the liquid immersion and vapor deposition methods. The contact angles between each film were measured to determine the effect of anti-adhesion on the molding process. In addition, atomic force microscopy (AFM) was used to measure the adhesion force between the H-PDMS and anti-adhesion layers. The results show that the coatings of anti-adhesion layers are an effective approach to improve the formability of molding.

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Periodical:

Key Engineering Materials (Volume 661)

Pages:

128-133

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.661.128

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Online since:

September 2015

Authors:

C.T. Pan*, T.L. Yang, C.H. Chao, Z.K. Wang, P.R. Ni

Keywords:

AFM, Anti-Adhesion, DLC, H-PDMS, PFOTCS, Soft-Lithography

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* - Corresponding Author

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