High Temperature Bonding Effect of the Room-Temperature-Curing Phosphate Adhesive for C/C Composites

Ming Chao Wang; Meng Meng Zhuang; Xin Tao; Xi Qing Xu; Hai Tao Geng; Jia Chen Liu

doi:10.4028/www.scientific.net/KEM.680.179

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HomeKey Engineering MaterialsKey Engineering Materials Vol. 680High Temperature Bonding Effect of the...

High Temperature Bonding Effect of the Room-Temperature-Curing Phosphate Adhesive for C/C Composites

Abstract:

A heat-resistant phosphate adhesive was developed for joining and repairing of C/C composites. The high-temperature bonding effect for both cured adhesive and 1300°C-calcined adhesive had been evaluated through testing high-temperature shear strength of corresponding joints. The results showed that the bonding strength of cured adhesive decreased from 7.9 MPa at RT to 0.9 MPa at 1300°C, while that of 1300°C-calcined adhesive could maintain about 4 MPa at temperature range from RT to 700°C and then decreased to 1.7 MPa at 1300°C. Besides, with the increasing thermal cycling times at 1300°C, the high-temperature bonding strength at this temperature could maintain at about 2.3 MPa.

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Periodical:

Key Engineering Materials (Volume 680)

Pages:

179-183

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.680.179

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Online since:

February 2016

Authors:

Ming Chao Wang, Meng Meng Zhuang, Xin Tao, Xi Qing Xu, Hai Tao Geng, Jia Chen Liu*

Keywords:

C/C Composites, High-Temperature Bonding Effect, Phosphate Adhesive

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