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Mathematical Modeling of the Technological Process of Residual Stresses Relief in Metals at Low-Temperature Exposure

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Abstract:

Low-temperature technological process of residual stresses relief in metals is modeled. The paper presents the mode of a slow heating stage, holding stage at a constant temperature and slow cooling stage. The holding stage is simulated with creeping properties of materials. Boundary problems are examined and patterns that are responsible for the removal of residual stresses are described. In Norton creep conditions we obtained analytical solutions.

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High Technology: Research and Applications 2015 View Preview

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Periodical:

Key Engineering Materials (Volume 685)

Pages:

27-31

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.685.27

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Online since:

February 2016

Authors:

Marina V. Polonik*, Egor E. Rogachev

Keywords:

Annealing, Elastic-Creep Deformation, Loading Pressure, Plastic Flow, Residual Stresses, Temperature Exposure

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© 2016 Trans Tech Publications Ltd. All Rights Reserved

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