Finite Element Analysis of SiCp/Al Model of Unit Cell during Ultrasonic Vibration Scratching

G.Q. Liang; Ping Fa Feng; Jian Fu Zhang

doi:10.4028/www.scientific.net/KEM.693.1022

Paper Titles

Wear Mechanism of PCBN Hard Cutting the Powder Metallurgy Valve Seats
p.996

A Study on Heat Transfer in High-Speed Grinding of Titanium Matrix Composites
p.1003

Experimental Optimization of Process Parameters for Turning TC11 Titanium Alloy Using Taguchi Methodology Design
p.1009

Experimental Study on the Wear of Single Crystal Diamond Tools in Ultra-Precision Cutting of Titanium Alloy
p.1015

Finite Element Analysis of SiCp/Al Model of Unit Cell during Ultrasonic Vibration Scratching
p.1022

Finite Element Analysis of Temperature Field in Vibration Milling
p.1030

Finite Element Deformation Analysis of Long Thin Cantilever Shape Parts in High Speed Ball End Milling of Titanium Alloy Ti-6Al-4V with PCD Tools at Various Tool Inclination Angles
p.1038

Finite Element Simulation of the Cutting Process for Inconel 718 Alloy Using a New Material Constitutive Model
p.1046

Finite Element Simulation on the Distribution of Discharge Gas in Hollow Cathode Plasma
p.1054

HomeKey Engineering MaterialsKey Engineering Materials Vol. 693Finite Element Analysis of SiCp/Al Model of Unit...

Finite Element Analysis of SiCp/Al Model of Unit Cell during Ultrasonic Vibration Scratching

Abstract:

In this paper, finite element model of SiCp /Al single cell body and single diamond particles were established by cross-scale modeling method. The results shows that the extent of damage of SiC particles increased with the increase of amplitude and frequency; The integrity of SiC particles are still better under the ultrasonic frequency 20000 Hz and the maximum amplitude 5um,so the optimal frequency range of ultrasonic scratch is (20000-30000)Hz. As for 22000 Hz, the integrity of SiC particles was better under the amplitude 4um,while the SiC particles have a significant damage in the border area under the amplitude 5um,so the best frequency and amplitude for ultrasonic scratches are: 22000 Hz and 4 um.

You might also be interested in these eBooks

Advanced Materials and Manufacturing Technology II

View Preview

Info:

Periodical:

Key Engineering Materials (Volume 693)

Pages:

1022-1029

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.693.1022

Citation:

Cite this paper

Online since:

May 2016

Authors:

G.Q. Liang*, Ping Fa Feng, Jian Fu Zhang

Keywords:

Scratching, SiC Particles, Ultrasonic Vibration, Unit Cell

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] Zheng XiJun, Mi Guofa. Research Status and Development Trend of SiCP/Al Composite, Material & Heat Treatment, 6( 2011) 92 -96.

Google Scholar

[2] Ge YingFei. Fundamental Research on Ultra-precision Turning of SiCp, Reinforced Aluminum Matrix Combosites, Nanjing University of Aeronautics and Astronautics , (2007).

Google Scholar

[3] FuYucan, Zhang Bei, XuHongjun, SuHonghua. Ductile Regin a Grinding of Brittle Material with Unifying Undefotmed Chip Thickness of Grain Cutting Edge, Journal of Nanjing University of Aeronautics & Astronautics, 2012, 05: 754-761.

Google Scholar

[4] S. Goel, Xichun Luo, etal. Brittle-ductile transition during diamond turning of single crystal silicon carbide, International Journal of Machine Tools&Manufacture, 2013, (65): 15-21.

DOI: 10.1016/j.ijmachtools.2012.09.001

Google Scholar

[5] Oliver W C, Pharr G M. An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments, Mater Res, 1992, 7(6): 1564-1583.

DOI: 10.1557/jmr.1992.1564

Google Scholar

[6] Fu Yucan, Zhang Bei Xu HongJun, Su Honghua. Ductile domain Grinding of Brittle Material with Unifying Undefotmed Chip Thickness of Grain Cutting Edge, Journal of Nanjing University of Aeronautics & Astronautics, 2012, 05: 754-761.

Google Scholar

[7] Deng ZhaoHui, Zhang Bi, Sun ZongYu, Zhou ZhiXiong. Material Removal Mechanisn in Ceramic Grinding, Chinese mechanical engineering, 2002, 18: 84-87+6.

Google Scholar

[8] Johnson GR, Cook WH. A constitutive model and data for metals subjected to large strains, high strain rates and high temperatures. In: Proceedings of the Seventh International Symposium on Ballistics. The Hague, Netherlands, 1983. 541-547.

Google Scholar

[9] Li Kai, Zhu JianSheng, Qian ZhiBo, Dong ShuNan, Ni Tian. Numerical Simulation of Drop Weight Impact Tests for Comp. B Using Johnson-Cook Constitutive Model,J. Mechanics in Engineering, 2011, 01: 21-23+73.

Google Scholar

[10] Ning Hou, Li Zhou. Finite Element and Experimental Analysis of Edge Defects Formation during Orthogonal Cutting of SiCp/Al Composites J. Advanced Materials Research, 2012, 500: 146-151.

DOI: 10.4028/www.scientific.net/amr.500.146

Google Scholar